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| N.º art.: 3318E-1822937 N.º fabricante: 84512-102LF EAN/GTIN: Sin datos |
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![](/p.gif) | High density, high speed, discrete contact, array connector Flexible ground distribution optimizes high speed signal integrity 10Gb/s differential pair performance with under 1% cross-talk 28Gb/s high speed performance documented for 4 mm and 6 mm stack height Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market 1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility 6 PCB Stack heights: 4 mm to 14mm 8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform High density standard BGA attachment lower assembly costs by using standard SMT processes BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage Patented BGA contact attachment preserves solder ball positioning Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options100 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free Más información: ![](/p.gif) | ![](/p.gif) | Número de Contactos: | 100 | Número de Filas: | 10 | Género: | Macho | Paso: | 1.27mm | Tipo de Montaje: | Montaje Superficial | Método de Terminación: | Soldador | Valor Nominal de Corriente: | 450mA | Revestimiento del Contacto: | Oro | Serie: | Meg-Array | Temperatura Mínima de Funcionamiento: | -40.0°C | Temperatura Máxima de Funcionamiento: | 85.0°C | Tensión Nominal: | 200,0 v ac | Material del Contacto: | Cobre | Material de la Carcasa: | LCP |
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![](/p.gif) | Otros conceptos de búsqueda: conector idc, 1822937, Conectores, Carcasas de Cables y Conectores para PCB, Amphenol Communications Solutions, 84512102LF |
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